Product Overview
Our precision heat sink accessories are key components specifically designed to optimize the thermal management performance of electronic devices. Made of high-quality aluminum and copper alloys and manufactured through advanced processing techniques, it ensures excellent heat dissipation for your CPU, GPU, power amplifiers and other high-power consumption chips. Whether it is consumer electronics, communication equipment or automotive electronics, our accessories can effectively enhance system stability and extend the lifespan of equipment.
Core features and advantages
Outstanding thermal performance
High-efficiency heat conduction: Made of high-quality aluminum alloys and copper alloys such as 1050, 6061 and 6063, it features excellent thermal conductivity and can quickly remove heat from the heat source.
Maximize surface area: The precise fin design provides the maximum effective heat dissipation area within a limited space, significantly enhancing convective heat transfer efficiency.
Top-notch manufacturing process
Precision extrusion and CNC machining: By combining extrusion forming with CNC precision machining, it ensures that the fins are thin and uniform, the base has extremely high flatness, and achieves the best contact with the chip.
Mirror-finish base: Optional mirror-finish processing technology is available to treat the base surface to an ultra-low roughness, minimizing contact thermal resistance and maximizing heat conduction efficiency.
Unparalleled reliability and consistency
Sturdy one-piece structure: Most accessories adopt an integrated molding design to avoid contact thermal resistance between the fins and the base, ensuring long-term stable performance.
Strict quality control: From raw materials to finished products, every link undergoes strict testing to ensure that each product meets specifications and has consistent and reliable performance.
High design and functional flexibility
Customized design: We can provide you with customized heat dissipation solutions based on your specific thermal and structural requirements.
Ready-to-use installation: It offers a variety of surface treatment options (such as anodizing) and installation accessories, making it convenient for you to integrate directly into your existing system.
Optional surface treatment
Anodic oxidation
Advantages: Enhance surface hardness, wear resistance and corrosion resistance; Black oxidation can simultaneously improve the efficiency of thermal radiation.
Electroless nickel plating
Advantages: It offers a uniform coating, has excellent anti-corrosion ability and weldability, and presents a bright silver appearance.
Conductive oxidation
Advantages: High cost-effectiveness, capable of providing basic anti-corrosion protection and maintaining the conductivity of the surface.
Technical specifications
Project Specifications
Materials: Aluminum alloy (1050, 6061, 6063, etc.)/copper alloy (C11000)
Precision extrusion, CNC machining, stamping and brazing processes
Thermal conductivity: Aluminum alloy: 150-220 W/m·K; copper alloy: ≥380 W/m·K
Surface treatments include anodizing (in multiple colors), electroless nickel plating, conductive oxidation, sandblasting, etc
Application fields: Communication equipment, automotive electronics, industrial automation, consumer electronics, LED lighting
Why choose us?
Professional Experience: With years of in-depth experience in the field of thermal management, I have a profound understanding of the heat dissipation requirements of various applications.
One-stop service: From design support, mold development, precision manufacturing to surface treatment, we offer vertically integrated one-stop solutions.
Quality Certification: The production system complies with the ISO9001 and IATF 16949 international quality standards to ensure the reliability of the products.
Global Services: We have provided high-quality products and services to numerous clients, including leading brands in the automotive and telecommunications industries.
Contact us immediately to get a free consultation on your customized heat dissipation solution!
